PRIME Z790-P WIFI D4 LGA 1700 INTEL 12TH&13TH GEN ATX PRIME Z790-P WIFI D4

Description

Asus Prime Z790-P WIFI D4 Gaming Desktop Motherboard – Intel Z790 Chipset – Socket LGA-1700 – ATX – Core, Pentium, Celeron Processor Supported – 128 GB DDR4 SDRAM Maximum RAM – DIMM, UDIMM – 4 x Memory Slots – Gigabit Ethernet – IEEE 802.11 a/b/g/n/ac/ax – HDMI – DisplayPort – 4 x SATA Interfaces

ASUS Prime series motherboards are expertly engineered to unleash the full potential of 13^th Gen Intel^® Core™ Processors. Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, PRIME Z790-P WIFI D4 provides users and PC DIY builders with a range of performance optimizations via intuitive software and firmware features.

FLEXIBILITY

Comprehensive controls form the foundation of the ASUS PRIME series. The PRIME Z790-P WIFI D4 motherboard packs flexible tools to tune every aspect of your system, enabling performance tweaks to perfectly match the way you work to maximize productivity.

Intelligent Control

ASUS Intelligent Control makes your PC smart. Along with taking care of complex tuning and dynamically optimizing essential aspects of your system, it offers intelligently simplified options for newcomers to PC DIY, as well as more comprehensive features for seasoned veterans.

All-Around Energy Efficiency

The Power Saving function contains several settings can easily optimize power consumption and maximize energy savings. You can enable a CPU power limit, darken Aura lighting, and set the fan profile to a power saving mode. You can also toggle the Power Saver plan that is built into Microsoft Windows.

COOLING

PRIME Z790-P WIFI D4 motherboard is engineered with multiple onboard heatsinks and an array of hybrid fan headers to ensure your rig stays cool and stable under intense workloads.

M.2 Heatsink

An M.2 heatsink takes care of the two M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers

VRM Heatsinks and Thermal Pads

The extensive surface area of the massive heatsinks cover the VRMs and chokes to improve heat dissipation. Together with specially engineered thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance.